Soldering of small IC`s without a PCB. Sometimes there is no Evaluation Board or a PCB, for such a case: hand soldering method if a result should be available on the same day. This method takes some hours to solder everything. IC package here: TSSOP-20 EP, Pitch 0.65mm. IC mounted upside down. Exposed Pad soldered with a copper heatsink. Advantages:
Disadvantages:
Um nicht falsche Trugschlüsse aufkommen zu lassen, selbstverständlich sind Layouts sinnvoll. |
Kupfer, Feile, Leiterplattenreste, Säge, übliche Werkzeuge und wärmefester, spaltüberbrückender Kleber (am besten schneller Zweikomponenten) mehr braucht man nicht.